MediaTek, a leading semiconductor company, has recently introduced the Dimensity 8300, a highly efficient chipset specifically designed for premium 5G smartphones. This latest addition to the Dimensity 8000 series integrates generative AI capabilities, low-power efficiency, adaptive gaming technology, and rapid connectivity, delivering flagship-level experiences within the premium 5G smartphone segment.
Built on TSMC’s 2nd-generation 4nm process, the Dimensity 8300 features an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores, all constructed on Arm’s latest v9 CPU architecture. MediaTek claims that the Dimensity 8300 achieves a 20% increase in CPU performance and a 30% peak improvement in power efficiency compared to its predecessor. The Mali-G615 MC6 GPU upgrade further enhances performance, providing up to 60% greater speed and 55% better power efficiency.
Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, highlighted the features of the Dimensity 8300, stating, “With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to compromise between accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities — they can have it all. The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency.”
The Dimensity 8300 is the first premium-tier SoC to offer full generative AI support, featuring the APU 780 AI processor. This enables developers to build innovative applications leveraging large language models (LLMs). The APU 780, sharing architecture with the flagship Dimensity 9300 SoC, delivers a 2x improvement and a 3.3x boost in AI performance over the Dimensity 8200. These AI capabilities elevate premium smartphone photography and video capturing to new heights.
To optimize battery life further, MediaTek has introduced the next generation of HyperEngine adaptive game technology, offering advanced power savings enhancements. This technology intelligently adapts to computing demands, monitors device temperature, and optimizes gameplay for full FPS, low lag, and seamless rendering.
The Dimensity 8300 supports ultra-fast speeds with a built-in 3GPP Release-16 standard 5G modem, utilizing scenario-specific optimizations for improved connectivity in challenging environments.
Additional key features of the MediaTek Dimensity 8300 include LP5x 8533Mbps and uFS4.0 MCQ memory for a 33% speed boost on LPDDR and up to 100% faster R/W to flash than its predecessor. MediaTek 5G UltraSave 3.0 improves 5G power efficiency by up to 20% in daily usage scenarios compared to the previous generation.
The Dimensity 8300 is set to power 5G devices launching in the global market before the end of 2023, marking a significant advancement in premium-tier chipset technology.
